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New bond issue: QUALCOMM issued international bonds (US747525BJ18) with a 3.25% coupon for USD 800.0m maturing in 2050

May 08, 2020 | Cbonds

May 06, 2020 QUALCOMM issued international bonds (US747525BJ18) with a 3.25% for USD 800.0m maturing in 2050. Bonds were sold at a price of 99.202%. Bookrunner: Bank of America Merrill Lynch, Barclays, JP Morgan, Goldman Sachs, BNP Paribas, Citigroup, Deutsche Bank. Depository: Clearstream Banking S.A., DTCC, Euroclear Bank.

Issue: QUALCOMM, 3.25% 20may2050, USD

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
outstandingUSA05/20/2050800,000,000 USDA2/A-/-


Full company nameQUALCOMM Incorporated
Country of riskUSA
Country of registrationUSA
IndustryInformation and High Technologies


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