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Preliminary agenda of the key event for EM debt professionals - Cbonds EM Bond Conference, April 11-12, 2019, Hong Kong

February 19, 2019 | Cbonds

Cbonds Group is happy to invite you to join the VIII Cbonds Emerging Markets Bond Conference to be held in Hong Kong on April 11-12, 2019

Register right now!  

The agenda of two days Cbonds EM Bond Conference includes the following topics: 
- Global macro & fixed income panel; 
- Institutional investors panel; 
- DCM panel; 
- Development of the Belt and Road Initiative on the capital markets; 
- Domestic and international bond markets in EM countries: Asia, CEEMEA (including Russia and CIS), Latin America; 
- Special section on BondTech - how new technologies change bond market? 

Preliminary agenda is available by the link.  

The expected number of participants is 150, including EM financial institutions and corporations, international rating agencies and infrastructure companies. Keep watching for the updates on the conference webpage: http://cbonds-congress.com/events/447/ 

PARTICIPATION 

The participation fee is 900 USD 
Special offer! 

- Representatives of financial sector, based in Hong Kong, are invited to participate for FREE
- Representatives of buy-side are invited to participate for FREE

To register for the event, please, fill in the registration form: http://cbonds-congress.com/events/447/registration/

*See full terms by the link: http://cbonds-congress.com/events/447/price/ 

PARTNERS  

Lead partner: Gazprombank; 
Sponsor: Moscow Exchange; 
Supporting Association and Partners: Pengyuan International; 
Lead information partner: Cbonds; 
Media partners: BNE, CEEMarketWatch. 

CONTACTS  

Agenda
Ekaterina Gritsenko kate@cbonds.info, +7 (812) 336-97-21 *223 
Dmitry Alekseev d.alekseev@cbonds.info, +7 (812) 336-97-21 *116
Sponsorship: Sergey Zobov szobov@cbonds.info, +7 (812)336-97-21 *103 
Participation: Ksenia Voronina ka@cbonds.info, +7 (812) 336-97-21 *132

Company: Cbonds Group

Full company nameCbonds Ltd
Country of riskRussia
IndustryInformation and High Technologies

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